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  4. Simplified Modelling of the Edge Crush Resistance of Multi-Layered Corrugated Board: Experimental and Computational Study
 
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Simplified Modelling of the Edge Crush Resistance of Multi-Layered Corrugated Board: Experimental and Computational Study

Type
Journal article
Language
English
Date issued
2023
Author
Garbowski, Tomasz 
Knitter-Piątkowska, Anna
Winiarski, Piotr
Faculty
Wydział Inżynierii Środowiska i Inżynierii Mechanicznej
Journal
Materials
ISSN
1996-1944
DOI
10.3390/ma16010458
Web address
https://www.mdpi.com/1996-1944/16/1/458
Volume
16
Number
1
Pages from-to
art. 458
Abstract (EN)
The edge crush test is the most popular laboratory test in the corrugated packaging industry. It measures the edge crush resistance of a sample in the cross-fiber direction (CD), also known as the ECT index. This parameter is widely used for the specification of the board by its producers. It is also utilized in most analytical formulas describing the load capacity of the packaging. On the other hand, the ECT value can be estimated from both analytical and numerical models based on the basic parameters of each constituent paper. Knowing the compressive strength in CD (commonly known as SCT) and the elastic properties of the individual layers, the sample geometry (i.e., the period and height of the corrugated layer), as well as the boundary conditions, the ECT value can be calculated. This is very useful as new boards can be virtually analyzed before being manufactured. In this work, both detailed numerical models based on finite elements (FE) methods and very simple analytical (engineering) models were used for the ECT calculations. All presented models were validated with experimental data. The surprising consistency and high precision of the results obtained with the simplest approach was additionally analyzed in the study.
Keywords (EN)
  • edge crush resistance

  • edge crush test

  • finite element analysis

  • analytical models

  • experimental data

  • corrugated cardboard

License
cc-bycc-by CC-BY - Attribution
Open access date
January 3, 2023
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