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  4. Archeological wood conservation with selected organosilicon compounds studied by XFM and nanoindentation
 
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Archeological wood conservation with selected organosilicon compounds studied by XFM and nanoindentation

Type
Journal article
Language
English
Date issued
2023
Author
Broda, Magdalena 
Jakes, Joseph E.
Li, Luxi
Antipova, Olga A.
Faculty
Wydział Leśny i Technologii Drewna
PBN discipline
forestry
Journal
Wood Science and Technology
ISSN
0043-7719
DOI
10.1007/s00226-023-01503-4
Web address
https://link.springer.com/article/10.1007/s00226-023-01503-4
Volume
57
Number
6
Pages from-to
1277-1298
Abstract (EN)
Waterlogged wood conservation is a complex and challenging task. Detailed knowledge about the interactions between the applied chemicals and wood is necessary to ensure the effective and safe conservation of wooden artifacts. The present research aims to determine the mechanism of dimensional stabilization of archeological wood by organosilicon compounds using the combination of synchrotron-based X-ray fluorescence microscopy (XFM) and nanoindentation. Archeological oak wood was treated with methyltrimethoxysilane, (3-mercaptopropyl)trimethoxysilane, or 1,3-bis-[(diethylamino)-3-(propoxy)propan-2-ol]-1,1,3,3-tetramethyldisiloxane, which in previous studies were found to be more effective than other organosilicons in stabilizing wood dimensions. The XFM and nanoindentation results showed that all three organosilicons infiltrated wood cell walls and enhanced their mechanical properties. The XFM also showed that part of the chemicals filled some void spaces like cell lumina. Based on the results obtained here and in our previous research, it is determined that the mechanism of archeological wood dimensional stabilization by organosilicon treatment is complex and likely involves both filling cell lumina and infiltration into cell walls where organosilicons interact with wood polymers.
Keywords (EN)
  • waterlogged archeological wood

  • wood conservation

  • wood consolidation

License
cc-bycc-by CC-BY - Attribution
Open access date
October 11, 2023
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