Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
| cris.virtual.author-orcid | 0000-0002-9588-2514 | |
| cris.virtual.author-orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.author-orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtualsource.author-orcid | ae71bc22-fde2-40b2-878c-e07e0e5aad5a | |
| cris.virtualsource.author-orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtualsource.author-orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| dc.abstract.en | When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhelmingly analog. Recently, new innovative technologies have emerged that have begun to replace or at least supplement old techniques. This paper presents the results of laboratory tests on corrugated board and packaging made using both analog and digital technologies. Cardboard samples with digital and analog creases are subject to various mechanical tests, which allows for an assessment of the impact of creases on the mechanical properties of the cardboard itself, as well as on the behavior of the packaging. It is proven that digital technology is not only more repeatable, but also weakens the structure of corrugated board to a much lesser extent than analog. An updated numerical model of boxes in compression tests is also discussed. The effect of the crushing of the material in the vicinity of the crease lines in the packaging arising during the analog and digital finishing processes is taken into account. The obtained enhanced computer simulation results closely reflect the experimental observations, which prove that the correct numerical analysis of corrugated cardboard packaging should be performed with the model taking into account the crushing. | |
| dc.affiliation | Wydział Inżynierii Środowiska i Inżynierii Mechanicznej | |
| dc.affiliation.institute | Katedra Inżynierii Biosystemów | |
| dc.contributor.author | Garbowski, Tomasz | |
| dc.contributor.author | Gajewski, Tomasz | |
| dc.contributor.author | Knitter-PiÄ…tkowska, Anna | |
| dc.date.access | 2026-01-30 | |
| dc.date.accessioned | 2026-02-10T08:38:10Z | |
| dc.date.available | 2026-02-10T08:38:10Z | |
| dc.date.copyright | 2022-06-25 | |
| dc.date.issued | 2022 | |
| dc.description.abstract | <jats:p>When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhelmingly analog. Recently, new innovative technologies have emerged that have begun to replace or at least supplement old techniques. This paper presents the results of laboratory tests on corrugated board and packaging made using both analog and digital technologies. Cardboard samples with digital and analog creases are subject to various mechanical tests, which allows for an assessment of the impact of creases on the mechanical properties of the cardboard itself, as well as on the behavior of the packaging. It is proven that digital technology is not only more repeatable, but also weakens the structure of corrugated board to a much lesser extent than analog. An updated numerical model of boxes in compression tests is also discussed. The effect of the crushing of the material in the vicinity of the crease lines in the packaging arising during the analog and digital finishing processes is taken into account. The obtained enhanced computer simulation results closely reflect the experimental observations, which prove that the correct numerical analysis of corrugated cardboard packaging should be performed with the model taking into account the crushing.</jats:p> | |
| dc.description.accesstime | at_publication | |
| dc.description.bibliography | il., bibliogr. | |
| dc.description.finance | publication_nocost | |
| dc.description.financecost | 0,00 | |
| dc.description.if | 3,9 | |
| dc.description.number | 13 | |
| dc.description.points | 100 | |
| dc.description.version | final_published | |
| dc.description.volume | 22 | |
| dc.identifier.doi | 10.3390/s22134800 | |
| dc.identifier.issn | 1424-8220 | |
| dc.identifier.uri | https://sciencerep.up.poznan.pl/handle/item/7274 | |
| dc.identifier.weblink | https://www.mdpi.com/1424-8220/22/13/4800 | |
| dc.language | en | |
| dc.relation.ispartof | Sensors | |
| dc.relation.pages | art. 4800 | |
| dc.rights | CC-BY | |
| dc.sciencecloud | nosend | |
| dc.share.type | OPEN_JOURNAL | |
| dc.subject.en | corrugated board | |
| dc.subject.en | digital crease | |
| dc.subject.en | analog crease | |
| dc.subject.en | edge crush test | |
| dc.subject.en | shear stiffness test | |
| dc.subject.en | transverse shear test | |
| dc.subject.en | bending stiffness | |
| dc.subject.en | box compression test | |
| dc.subject.en | finite element model | |
| dc.title | Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging | |
| dc.type | JournalArticle | |
| dspace.entity.type | Publication | |
| oaire.citation.issue | 13 | |
| oaire.citation.volume | 22 |