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Impact of thermal modification combined with silicon compounds treatment on wood structure

cris.virtual.author-orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.author-orcid0000-0003-3026-5192
cris.virtual.author-orcid0000-0003-3704-4149
cris.virtual.author-orcid0000-0003-0138-3034
cris.virtualsource.author-orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.author-orcidaf1b0375-c966-4ceb-a9cc-69bf4ed40a81
cris.virtualsource.author-orcid92cedaf4-e34b-41a0-96ab-690532a1623e
cris.virtualsource.author-orcidecba7829-1555-40c7-9a9b-e479473ebd4c
dc.abstract.enn the present study silicon containing formulations were investigated for their applicability in solid wood modification. Black pine sapwood was thermally modified at 180oC and 200oC (3, 5 and 7 hours) and afterwards,an additional chemical treatment with silicon containing systems (N-2-aminoethyl-3-aminopropyltrimethoxysilane) followed, in an attempt toinvigorate hydrophobicity and durability of wood. Infrared spectroscopy (FTIR) was used to examine the formation of new bonds in the treated materials and atomic absorption spectrometry (AAS) to measure the silane concentration. The results showed a high reactivity between thermally modified wood and organosilicon compounds. The presence of bands representing vibrationsof the Si–O–CH3group in IR spectra of modified wood and after extraction confirms the stable character of the formed bonds between the hydroxyl group of wood and the methoxy groups of organosilanes. Furthermore, reactivity between wood and AE-APTMOS and alkyd resin solution was confirmed by the AAS results. Alkyd resin caused ahigher concentration of silica in wood mass, which increases as the thermal treatment temperature increases. The organosilicon compounds caused a much higher resistance to water washout, revealing permanent binding of silanes to wood mass.
dc.affiliationWydział Leśny i Technologii Drewna
dc.affiliation.instituteKatedra Chemii
dc.affiliation.instituteKatedra Chemicznej Technologii Drewna
dc.contributor.authorKamperidou, Vasiliki
dc.contributor.authorRatajczak, Izabela
dc.contributor.authorPerdoch, Waldemar
dc.contributor.authorMazela, Bartłomiej
dc.date.access2026-02-25
dc.date.accessioned2026-02-25T08:10:04Z
dc.date.available2026-02-25T08:10:04Z
dc.date.copyright2022-04
dc.date.issued2022
dc.description.abstract<jats:p>In the present study silicon containing formulations were investigated for their applicability in solid wood modification. Black pine sapwood was thermally modified at 180oC and 200oC (3, 5 and 7 hours) and afterwards,an additional chemical treatment with silicon containing systems (N-2-aminoethyl-3-aminopropyltrimethoxysilane) followed, in an attempt toinvigorate hydrophobicity and durability of wood. Infrared spectroscopy (FTIR) was used to examine the formation of new bonds in the treated materials and atomic absorption spectrometry (AAS) to measure the silane concentration. The results showed a high reactivity between thermally modified wood and organosilicon compounds. The presence of bands representing vibrationsof the Si–O–CH3group in IR spectra of modified wood and after extraction confirms the stable character of the formed bonds between the hydroxyl group of wood and the methoxy groups of organosilanes. Furthermore, reactivity between wood and AE-APTMOS and alkyd resin solution was confirmed by the AAS results. Alkyd resin caused ahigher concentration of silica in wood mass, which increases as the thermal treatment temperature increases. The organosilicon compounds caused a much higher resistance to water washout, revealing permanent binding of silanes to wood mass.</jats:p>
dc.description.accesstimeat_publication
dc.description.bibliographyil., bibliogr.
dc.description.financepublication_nocost
dc.description.financecost0,00
dc.description.if1,3
dc.description.number5
dc.description.points70
dc.description.versionfinal_published
dc.description.volume67
dc.identifier.doi10.37763/wr.1336-4561/67.5.773784
dc.identifier.issn1336-4561
dc.identifier.urihttps://sciencerep.up.poznan.pl/handle/item/7457
dc.identifier.weblinkhttps://www.woodresearch.sk/cms/impact-of-thermal-modification-combined-with-silicon-compounds-treatment-on-wood-structure/
dc.languageen
dc.relation.ispartofWood Research
dc.relation.pages773-784
dc.rightsOther
dc.sciencecloudnosend
dc.share.typeOTHER
dc.subject.enalkyd resin
dc.subject.enAAS
dc.subject.encoating
dc.subject.enFTIR
dc.subject.enorganosilanes
dc.subject.enpreservation
dc.subject.enthermal treatment
dc.subject.enwood
dc.titleImpact of thermal modification combined with silicon compounds treatment on wood structure
dc.typeJournalArticle
dspace.entity.typePublication
oaire.citation.issue5
oaire.citation.volume67