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Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography

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dc.abstract.enThe mechanical properties of cured wood adhesive films were tested in a dry state by means of nanoindentation. These studies have found that the application of adhesives have an effect on the accuracy of the hardness and elastic modulus determination. The highest values of hardness among the tested adhesives at 20 °C have condensation resins: MF (0.64 GPa) and RPF (0.52 GPa). Then the decreasing EPI (0.43 GPa), PUR (0.23 GPa) and PVAc (0.14 GPa) adhesives. The values of the elastic modulus look a little bit different. The highest values among the tested adhesives at 20 °C have EPI (11.97 GPa), followed by MF (10.54 GPa), RPF (7.98 GPa), PVAc (4.71 GPa) and PUR (3.37 GPa). X-ray micro-computed tomography was used to evaluate the adhesive joint by the determination of the voids. It has been proven that this value depends on the type of adhesive, glue quantity and reactivity. The highest values of the void ratio achieve the PUR (17.26%) adhesives, then PVAc (13.97%), RRF (6.88%), MF (1.78%) and EPI (0.03%). The ratio of the gaps increases with the higher joint thickness. A too high proportion of voids may weaken the adhesive joint.
dc.affiliationWydział Leśny i Technologii Drewna
dc.affiliation.instituteKatedra Nauki o Drewnie i Techniki Cieplnej
dc.contributor.authorBernaczyk, Arkadiusz
dc.contributor.authorWagenführ, André
dc.contributor.authorZboray, Robert
dc.contributor.authorFlisch, Alexander
dc.contributor.authorLüthi, Thomas
dc.contributor.authorVetter, Birgit
dc.contributor.authorRentsch, Mario
dc.contributor.authorTerfloth, Christian
dc.contributor.authorLincke, Jörg
dc.contributor.authorKrystofiak, Tomasz
dc.contributor.authorNiemz, Peter
dc.date.access2026-03-09
dc.date.accessioned2026-03-19T12:15:12Z
dc.date.available2026-03-19T12:15:12Z
dc.date.copyright2022-12-02
dc.date.issued2022
dc.description.abstract<jats:p>The mechanical properties of cured wood adhesive films were tested in a dry state by means of nanoindentation. These studies have found that the application of adhesives have an effect on the accuracy of the hardness and elastic modulus determination. The highest values of hardness among the tested adhesives at 20 °C have condensation resins: MF (0.64 GPa) and RPF (0.52 GPa). Then the decreasing EPI (0.43 GPa), PUR (0.23 GPa) and PVAc (0.14 GPa) adhesives. The values of the elastic modulus look a little bit different. The highest values among the tested adhesives at 20 °C have EPI (11.97 GPa), followed by MF (10.54 GPa), RPF (7.98 GPa), PVAc (4.71 GPa) and PUR (3.37 GPa). X-ray micro-computed tomography was used to evaluate the adhesive joint by the determination of the voids. It has been proven that this value depends on the type of adhesive, glue quantity and reactivity. The highest values of the void ratio achieve the PUR (17.26%) adhesives, then PVAc (13.97%), RRF (6.88%), MF (1.78%) and EPI (0.03%). The ratio of the gaps increases with the higher joint thickness. A too high proportion of voids may weaken the adhesive joint.</jats:p>
dc.description.accesstimeat_publication
dc.description.bibliographyil., bibliogr.
dc.description.financepublication_nocost
dc.description.financecost0,00
dc.description.if3,4
dc.description.number23
dc.description.points140
dc.description.versionfinal_published
dc.description.volume15
dc.identifier.doi10.3390/ma15238604
dc.identifier.issn1996-1944
dc.identifier.urihttps://sciencerep.up.poznan.pl/handle/item/7822
dc.identifier.weblinkhttp://www.mdpi.com/1996-1944/15/23/8604
dc.languageen
dc.relation.ispartofMaterials
dc.relation.pagesart. 8604
dc.rightsCC-BY
dc.sciencecloudnosend
dc.share.typeOPEN_JOURNAL
dc.subject.enwood gluing
dc.subject.enbeech
dc.subject.enwood adhesives
dc.subject.enadhesive joint
dc.subject.enhardness
dc.subject.enmechanical properties
dc.titleInvestigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
dc.title.volumeSpecial Issue Research and Application Progress of Wood Adhesives
dc.typeJournalArticle
dspace.entity.typePublication
oaire.citation.issue23
oaire.citation.volume15