The effect of using wood chips exposed to mold fungi on the properties of chipboard

cris.virtual.author-orcid0000-0002-4881-579X
cris.virtual.author-orcid0000-0002-5539-1841
cris.virtual.author-orcid0000-0001-6197-7825
cris.virtual.author-orcid0000-0002-9011-8592
cris.virtual.author-orcid0000-0002-8365-3714
cris.virtualsource.author-orcid06c6ca28-0e9e-49db-83ae-a5207d5e6251
cris.virtualsource.author-orcid87e8382f-cc8f-47b2-8f39-361784e40657
cris.virtualsource.author-orcidb7758df3-1f26-41db-803a-d0c9e2331765
cris.virtualsource.author-orcid5a92c57a-50a8-4d53-a17d-17ad767a350e
cris.virtualsource.author-orcidaf92c528-8fcb-4483-aa2a-610248fa3898
dc.abstract.enConsidering that commonly occurring mold fungi have the ability to develop very quickly on the surface of wood chips and the ongoing studies on finding the ways to use degraded wood, the conducted research was aimed at determining the physical and mechanical properties of chipboards containing various amounts (0%, 30%, 50%, and 70%) of pine chips inoculated with Aspergillus and Penicillium fungi, varying in a degree of infestation. The inoculation did not cause significant changes in the chemical composition of chips; however, it caused a decrease in the pH of their surface after nine-week incubation. While using them, lowered pH caused a deterioration in the mechanical characteristics of the boards and increased their thickness swelling and water absorption. Moreover, no changes in density, formaldehyde content and decomposition by brown-rot fungi were found. Overall, it was concluded that the addition of partially infested chips did not significantly affect any properties of the board; however, in the case of complete overgrowth, the amount of degraded chips should be less than 30%.
dc.affiliationWydział Leśny i Technologii Drewna
dc.affiliation.instituteKatedra Mechanicznej Technologii Drewna
dc.affiliation.instituteKatedra Chemii
dc.contributor.authorMirski, Radosław
dc.contributor.authorKawalerczyk, Jakub
dc.contributor.authorDziurka, Dorota
dc.contributor.authorStuper-Szablewska, Kinga
dc.contributor.authorWalkiewicz, Joanna
dc.date.accessioned2025-07-22T10:41:51Z
dc.date.available2025-07-22T10:41:51Z
dc.date.issued2024
dc.description.bibliographybibliogr.
dc.description.financepublication_nocost
dc.description.financecost0,00
dc.description.if2,1
dc.description.number4
dc.description.points100
dc.description.volume19
dc.identifier.doi10.1080/17480272.2023.2291534
dc.identifier.eissn1748-0280
dc.identifier.issn1748-0272
dc.identifier.urihttps://sciencerep.up.poznan.pl/handle/item/3924
dc.languageen
dc.pbn.affiliationforestry
dc.relation.ispartofWood Material Science and Engineering
dc.relation.pages920-930
dc.rightsClosedAccess
dc.sciencecloudnosend
dc.subject.enmold fungi
dc.subject.enchipboard
dc.subject.endegraded wood chips
dc.subject.enAspergillus
dc.subject.enPenicillium
dc.titleThe effect of using wood chips exposed to mold fungi on the properties of chipboard
dc.typeJournalArticle
dspace.entity.typePublication
oaire.citation.issue4
oaire.citation.volume19